The Superconductive Circuit Board

    Aluminum Trace Printed Circuit Board Innovation

    Wed, Mar 13, 2019 @ 03:08 PM Omni Team circuit board, multi-layer, pcb, drilling, manufacturing, challenging, engineering, aluminum pcb, aluminum trace

    The journey to develop a circuit board which features aluminum circuitry (Aluminum PCBs ) has been challenging.

    Aluminum pcb cross section

    Beginning in 2008, Omni Circuit boards was challenged by a strategic partner with developing a circuit board with fine-line aluminum traces. The reason for aluminum in the initial quest was for its superconducting (cryogenic) properties. But as time went by, we began to appreciate how developing this capability could also benefit customers who have a requirement for aluminum wire bonding of critical components.

    Initial research uncovered numerous previous attempts to etch aluminum circuit designs although we could not find evidence of successful commercialization of the process. Some information would be gleaned from expired patents, but in the end, the process required a stream of painstaking lab and field tests.

    It would be 5 years before the development team could graduate from working with simple test patterns to functional circuit boards which could be populated and installed in customer products. The development team has changed over the years, but the group that successfully found a way to commercialize TMEC was mainly comprised of chemists and engineers with support from shop and office personnel.

    The key to this process is a micro-foil material constructed of a 40 µm core of aluminum with a 5 µm electro-deposited layer of copper. This micro-foil is then laminated onto a non-conductive substrate (typically FR4).

    The process of manufacturing Aluminum Printed Circuit boards is much the same as traditional PCB production until the etching process:

    • Cad / Cam work is performed from supplied customer files
    • Film is produced on a photo plotter
    • The Al / Cu foil is laminated onto a non-conductive substrate
    • A photo-resist is applied to the circuit board
    • The circuit is imaged onto the laminated board
    • A series of aluminum and copper etchs are conducted before a final copper etch to remove unwanted copper
    • Mechanical drilling and routing is done before and/or after etching
    • Soldermask and/or component legends are applied in the conventional manner

    The result is a lightweight bi-metal electronic circuit board with fine-line aluminum conductors.

    For more information about Aluminum Circuit Boards please visit our Aluminum Trace Circuit Board Design page and corresponding white-paper on the topic.

    aluminum trace design kit

    Omni Team

    Written by Omni Team