About OMNI 


Omni Circuit Boards is your source for superconducting cryogenic PCB manufacturing, in other words, PCBs capable to operate at very low temperatures.

If you need reliable superconducting PCBs or PCBs for aluminum wire-bonding, please contact us.

We are familiar with the thermal properties of our PCBs down to millikelvin temperatures, the challenges of thermal cycling, and making superconducting connections to our PCBs.

We are the proud manufacturer of the cryogenic Aluminum-Trace Printed Circuit Boards found in D-Wave quantum computers. These PCBs have operated flawlessly at temperatures down to 10 mK, and have remained in service for years.

We have also been a Global Provider of Copper Printed Circuit Boards manufacturing and layout services for more than 25 years’. Omni Circuit Boards was founded as a print shop in 1985 (Omni Graphics) though quickly evolved into a premier Printed Circuit Board manufacturer for prototyping, short runs and urgent R&D response projects.

Omni maintains a tradition of providing the highest standards of precision engineering, quality control and technical support possible. Our customers are among the most prestigious universities, OEM technology and R&D companies in the world.

In 2020 we continue focusing our R&D efforts on the manufacturing of reliable Aluminum-Trace PCBs (super low temperature capable PCBs - used in cryogenics).



About Superconductive Aluminum-Trace PCBs 

Aluminum-Trace Printed Circuit Boards provide the design solution to challenges faced with low temperature superconductive circuit boards and applications where the radiation-absorption properties of aluminum can be exploited.

By successfully developing a process of chemically milling circuit boards with an aluminum circuitry, we are able to provide a design solution to a number of unique applications previously constrained by conventional PCB materials and processes.

The process of producing PCBs with aluminum circuitry is unique and different from the commonly known "Aluminum PCBs", reason why we refer to them as "Aluminum-Trace PCBs".

The aluminum circuit begins with ultra-thin sheets of 30 µm aluminum foil. Depending on the customer's requirements a mere 5 µm film of copper can be layered between the aluminum and dielectric to enhance the thermal conductivity of the device.

µm copper layer  can also be provided on pads on the top side to enhance solderability.

These layered sheets are laminated together to customer specific configurations.

After machining, a series of processing stages produce the fine lines and finally the solder mask and silk screening artwork is provided.

The end product is a printed circuit board with fine-line aluminum traces and solderable aluminum pads which in turn make them superconductive, this is what makes "Aluminum-Trace PCBs" special.

The design guide below is a current state of the capabilities for which we have process control, however, more has already been achieved and is under the prototype stages. 


Design Guide for Aluminum Trace PCBs


Characteristics - 2 Layer Boards

Specifications Plated Through Hole Version Non Plated Through Hole Version
Aluminum thickness 20µm, 22µm
(lower or higher upon request)
Aluminum alloy Pure aluminum AL 3003 H18
Base material type AD1000 - Rogers
4350B - Rogers
P96/P26 - Isola
Electrical testing Very limited, would need to be accounted for during layout design
Lead time 8 weeks standard,
expedite available
3 weeks standard,
expedite available
Material thickness As per base material type offerings from manufacturer 0.009"- 0.031"
Maximum operating temperature (Estimated) TBD 110° C
Minimum operating temperature Absolute zero
Trace superconducting temperature 1.1 K 500 milliKelvin
Minimum printed circuit board size 0.10"x 0.10"
Maximum printed circuit board size 12" x 16"
Panelization Options Singles, tab-routed, v-score
Quantity Low to medium volume
Silkscreen colour Black, white or yellow
Silkscreen layer None, top and/or bottom
Solder mask colour Green, white, black, blue or red
Surface finish Aluminum with selective copper














Specifications Plated Through Hole Version Non Plated Through Hole Version
Holes bigger than 0.250" Are routed
Intersecting or overlapping drills Not possible, will be routed
Possible drill sizes 0.012" to 0.250"
Smallest finish hole size 0.010"
Smallest spacing between drilled holes (drill edge to drill edge) 0.010"
PTH (plated through holes) 0.012" to 0.062" Not available
Available routing diameters 0.0315" up to 0.0940"
Plated slots 0.031" to 0.062" Not available
Smallest radius (inner corners) 0.01575"
Smallest routed slot width 0.0315"
Solder Mask  
Solder mask clearance to metal 0.002"
Minimum clearance to unmasked aluminum 0.005"
Smallest distance between lines 0.005"
Smallest lines 0.005"
Smallest text lines 0.006"
Specifications Plated Through Hole Version Non Plated Through Hole Version
Base materials RoHS-compliance Standard
IPC-Standards IPC-A-600 - Class 2, if applicable
Material thickness tolerances Dependent on base material type selected +/-10%
Max. offset drill centre to centre of reference 0.002"
Photolithography registration tolerance 0.005"
Routing tolerance 0.005"
Smallest annular ring 0.020"
Smallest SMD pitch 0.010"
Smallest space width 0.005"
Space width variability +/- 0.002"
Smallest trace width 0.008" (smaller upon request and at a lower yield)
Trace width variability +/- 0.002"
UL-approval Standard Not Standard
V-Score core remaining 0.010"
V-Score position to aluminum features 0.015"