About OMNI 


Omni Circuit Boards is your source for superconducting cryogenic PCB manufacturing, in other words, PCBs capable to operate at very low temperatures.

If you need reliable superconducting PCBs or PCBs for aluminum wire-bonding, please contact us.

We are familiar with the thermal properties of our PCBs down to millikelvin temperatures, the challenges of thermal cycling, and making superconducting connections to our PCBs.

We are the proud manufacturer of the cryogenic Aluminum-Trace Printed Circuit Boards found in D-Wave quantum computers. These PCBs have operated flawlessly at temperatures down to 10 mK, and have remained in service for years.

We have also been a Global Provider of Copper Printed Circuit Boards manufacturing and layout services for more than 25 years’. Omni Circuit Boards was founded as a print shop in 1985 (Omni Graphics) though quickly evolved into a premier Printed Circuit Board manufacturer for prototyping, short runs and urgent R&D response projects.

Omni maintains a tradition of providing the highest standards of precision engineering, quality control and technical support possible. Our customers are among the most prestigious universities, OEM technology and R&D companies in the world.

In 2020 we continue focusing our R&D efforts on the manufacturing of reliable Aluminum-Trace PCBs (super low temperature capable PCBs - used in cryogenics).



About Superconductive Aluminum-Trace PCBs 

Aluminum-Trace Printed Circuit Boards provide the design solution to challenges faced with low temperature superconductive circuit boards and applications where the radiation-absorption properties of aluminum can be exploited.

By successfully developing a process of chemically milling circuit boards with an aluminum circuitry, we are able to provide a design solution to a number of unique applications previously constrained by conventional PCB materials and processes.

The process of producing PCBs with aluminum circuitry is unique and different from the commonly known "Aluminum PCBs", reason why we refer to them as "Aluminum-Trace PCBs".

The aluminum circuit begins with ultra-thin sheets of 30 µm aluminum foil. Depending on the customer's requirements a mere 5 µm film of copper can be layered between the aluminum and dielectric to enhance the thermal conductivity of the device.

µm copper layer  can also be provided on pads on the top side to enhance solderability.

These layered sheets are laminated together to customer specific configurations.

After machining, a series of processing stages produce the fine lines and finally the solder mask and silk screening artwork is provided.

The end product is a printed circuit board with fine-line aluminum traces and solderable aluminum pads which in turn make them superconductive, this is what makes "Aluminum-Trace PCBs" special.

The design guide below is a current state of the capabilities for which we have process control, however, more has already been achieved and is under the prototype stages. 


Design Guide


 Specifications Standard
  Aluminum thickness 30µm and/or 40µm
  Aluminum alloy 3003 H18
  Base material type FR4
  Bevelling Available
  Counter-sink-holes Available
  Electrical testing Flying Probe
  Jump V-Score Available
  Lead time 10WD standard, expedite available
  Material colour Natural FR4 (Orange)
  Material thickness .005"- .125"
  Maximum operating temperature (Estimated) 110° C
  Minimum operating temperature Absolute Zero
  Trace superconducting temperature range 500 milliKelvin and lower
  Minimum printed circuit board size 0.10"x 0.10"
  Maximum printed circuit board size 12" x 16"
  Panelization Options Singles, tab-routed, v-score
  Quantity Any
  Routing or V-scoring Available
  Silkscreen colour Black, white or yellow
  Silkscreen layer None, top and/or bottom
  Solder mask colour Green, white, black, blue or red
  Surface finish Natural Aluminum



NPTH (non-plated through holes)  Notes
  Holes > 0.250" Are routed
  Intersecting or overlapping drills Not possible, will be routed
  Possible drill sizes 0.010" to unlimited (all common sizes)
  Smallest drill size (final diameter) 0.010"
  Smallest spacing between drilled holes (drill edge to drill edge) 0.010"
PTH (plated through holes) * See notes below
Routing (non-plated)  
  Available routing diameters 0.0315" up to 0.0940"
  Inner routing Possible
  Smallest radius (inner corners) 0.01575"
  Smallest routed slot width 0.0315"
Solder Mask  
  Solder mask clearance to metal 0.002"
  Smallest solder mask web (round) 0.004"
  Smallest solder mask web (straight) 0.006"
  Smallest text lines 0.006"
  Minimum clearance to unmasked aluminum 0.005"
  Smallest distance between lines 0.005"
  Smallest lines 0.005"
  Smallest text lines 0.005"


Fabrication Tolerances

  Base materials RoHS-compliance Standard
  IPC-Standards IPC-A-600 - Class 2, if applicable
  Material thickness tolerances +/-10%
  Max. offset drill centre to centre of reference 0.002"
  Photolithography registration tolerance 0.005"
  Routing tolerance 0.005"
  Smallest annular ring 0.020"
  Smallest pitch 0.010"
  Smallest space distance 30µm aluminum 0.003"
  Smallest space distance 40µm aluminum 0.004"
  Space Width Variability 0.002"
  Smallest trace 0.005"
  Trace Width Variability 0.002"
  UL-approval Not Standard
  V-Score core remaining 0.010"
  V-Score position to aluminum features 0.015"